Ironwood-electronics Kelvin testing using GHz socket Instrukcja Użytkownika Pobierz pdf (Strona 3)

Tel: (800) 404-0204

www.ironwoodelectronics.com

of the bisected pad.

15.225mm

±0.125mm sqr.

Socket size

Orientation Mark

Non plated mounting hole

Non plated alignment hole

2.72mm*

1.68mm

0.5mm typ.

5.08mm

2.54mm

12.725mm

±0.125mm (x 4)

0.69 x 0.28 mm

9.36mm

7.78mm

1.25mm

±0.125mm (x 4)

1.25mm

±0.13mm (x 4)

Ø 1.61mm

0.050mm

(x 4)

Ø 0.85mm

0.025mm

(x 2)

pad (x 64)

MLF64A

Figure 3A: Suggested PCB layout for SG-MLF-7008

Figure 3B: Split pad layout

For our purposes, an SG-MLF-7008 was used with a 64-position MLF test chip. The chip

was set up in a daisy chain pattern and provides a resistance through spiral circuitry from

bottom to top of board (Figure 4). The target board allows Kelvin connections to every pin.

The results are shown below in Fig. 5.

1 2 3 4 5

Brak uwag

Ironwood-electronics Kelvin testing using GHz socket Instrukcja Użytkownika Strona 3